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MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid Protection

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MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid Protection

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Brand Name : Hiner-pack

Model Number : HN23044

Place of Origin : China

Certification : CE、FCC、RoHS

MOQ : 1000 pcs

Price : $1.35~$2.38(Prices are determined according to different incoterms and quantities)

Packaging Details : 70~100pcs/carton(According to the customer demand)

Delivery Time : 1~2 Weeks

Payment Terms : 100% Prepayment

Supply Ability : 2000PCS/Day

Material : MPPO

Size : Standard

Overall size/mm : 322.6x135.9x7.62

Product Name : JEDEC Matrix Trays

Lid Type : Snap-On

Stackable : Yes

Lid Material : MPPO

Cavity size/mm : 8.2*7.2*1.38

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MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid Protection


Designed with your product in mind, our JEDEC trays support tight tolerances and automated handling systems.


The trays are made from MPPO material, which provides excellent durability and resistance to impact and stress. The temperature range of the JEDEC Matrix Trays is also impressive, with a range of 0°C to +180°C. This makes them suitable for use in a wide range of environments and applications, including in the manufacturing of electronic components and devices.


For those in the electronics industry, the JEDEC Matrix Trays are an ideal choice for safely storing and transporting delicate components. Additionally, the JEDEC Matrix Trays are anti-static, providing a further layer of protection against damage from static electricity. This makes them an ideal choice for use in environments where static electricity may be a concern, such as in clean rooms or other sensitive manufacturing environments.


Technical Parameters:


Brand Hiner-pack Outline Line Size 322.6*135.9*7.62mm
Model HN23044 Cavity Size 8.2*7.2*1.38 mm
Package Type IC Component Matrix QTY 11*5=55PCS
Material MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS

Applications:


Ideal for semiconductor packaging, testing, and automated board assembly operations, this tray excels where component integrity and process efficiency are priorities. It supports robotic pick-and-place activities and integrates into handling systems without the need for modification. The tray is also suitable for environments requiring frequent movement between stations—such as SMT lines, cleanrooms, or IC programming labs—where consistent component orientation and secure seating are essential.

Customization:


Adapt the tray’s internal layout and appearance to meet unique manufacturing or part-specific needs:
• Customized Pocket Geometry: Modify cell shapes, wall heights, or part-retention details to accommodate varied device profiles.
• Color Selection: Choose ESD-safe colors to differentiate production batches, product types, or workflow stages.
• Integrated Molded Identification: Add part numbers, process codes, or customer logos as permanent molded features for easy traceability.

Product Tags:

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