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JEDEC IC Trays For Secure Semiconductor Component Storage

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Shenzhen Hiner Technology Co., Ltd.

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JEDEC IC Trays For Secure Semiconductor Component Storage

Name: JEDEC IC Trays For Secure Semiconductor Component Storage
Brand: Hiner-pack
Price: 1.35 USD

Best JEDEC IC Trays For Secure Semiconductor Component Storage wholesale

MOQ : 500

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Payment Terms : T/T

Reusable : Yes

Flatness : Less than 0.75mm

Model Number : HN25072

Color : Black

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Mold Type : Injection

Capacity : 5X6＝30 PCS

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

Supply Ability : 2000PCS/Day

Tray Shape : Rectangular

Packing Level : Transport package

Brand Name : Hiner-pack

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Packaging Details : CARTON, PALLET

Ic Type : BGA,QFP,QFN,LGA,PGA

Place of Origin : China

Cavity Size : 28×18.8×3.53 mm

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JEDEC IC Trays For Secure Semiconductor Component Storage

Searching reliable carriers for sensitive semiconductor chips? JEDEC IC trays built for chip storage and transit. Withstand high working temperature, block dust and physical harm toward delicate electronic parts.

Fit varied chip models. Custom cavity layout acts as core service. Adjust dimension, cavity count and heat resistance to satisfy unique project requirements.

Work for semiconductor assembling, chip testing and component transit. Keep chips steady through high‑temperature processing. Deliver steady protection in full production flow.

Key Features/ Benefits

RoHS compliant materials
Anti‑static property protect chips
Customizable cavity design
Secure component retention
Precise cavities lock components firmly

Specifications

Brand		Hiner-pack
Model		HN25072
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		28×18.8×3.53 mm
Matrix QTY		5X6＝30 PCS
Warpage		MAX 0.75mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support semiconductor chip testing and high‑temperature reflow production. Secure electronic parts within automated assembly lines.

Fit mass component transit and warehouse storage. Shield sensitive IC units for local and cross‑border shipment. Deliver custom solution for special chip specifications.

Packaging & Shipping/ Services

Neat stacking with protective separators in carton boxes. Robust outer packaging prevent collision damage. Ship by sea air or express. Maintain stable lead time. Reliable packing lower risks for long‑distance transport.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

JEDEC IC Trays For Secure Semiconductor Component Storage Images

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