Product Description:
The JEDEC standard matrix tray represents a critical benchmark in the microelectronics industry, setting the specifications for the safe handling, transport, and storage of Integrated Circuits (ICs), modules, and sensitive components. These standardized carriers are commonly referred to as "matrix" trays due to the precise arrangement of components nestled into fixed-position pockets, defined by rows and columns. The defining feature of all JEDEC standard trays is their globally uniform outline dimensions of 12.7 x 5.35 inches (322.6 x 136mm). This unwavering dimensional consistency makes them the universal language for automated equipment operation worldwide.
Features:
JEDEC trays incorporate numerous engineering features optimized for high-volume automation and component safety. The foremost benefit is the Industry Standard recognition; instant access to global equipment and accessories is guaranteed, which significantly de-risks equipment design, accelerates development time, and lowers overall cost. Critical design elements facilitate seamless automation. The tray's center area features flat cells specifically contoured for automated handling via vacuum pick-up tools, ensuring reliable component transfer. For mechanical alignment, a distinct scalloped feature (scalloped feature) is sculpted into one side, allowing the use of a locating pin to mechanically fix the correct orientation during use. A crucial visual aid is the 45-degree chamfer located in one corner, which provides an unambiguous visual indicator for the Pin 1 orientation of the components within the matrix.
Technical Parameters:
| Brand |
Hiner-pack |
| Model |
HN24145 |
| Material |
PPE |
| Package Type |
IC Component |
| Color |
Black |
| Resistance |
1.0x10e4-1.0x10e11Ω |
| Outline Line Size |
322.6x135.9x7.62mm |
| Cavity Size |
13*13*2.11mm |
| Matrix QTY |
6*16=96PCS |
| Flatness |
MAX 0.76mm |
| Service |
Accept OEM, ODM |
| Certificate |
RoHS, IOS |
Applications:
1. Automated Test and Assembly: Their most intensive use is in automated test and assembly processes. The components, ranging from through-hole (PGA, DIP) to surface mount (QFP, BGA) and leadless devices (LGA, QFN), are presented to pick-and-place machines in a precise, machine-readable matrix format.
2. Global Transport and Secure Storage: Parts loaded into stacked JEDEC trays offer an easy, efficient, and highly protective solution for storage and global logistics. The stacking feature inherently allows each successive tray to act as a protective cover for the one beneath it.
3. Process Compatibility: Trays function as carriers for components through various manufacturing steps, which can include high-temperature processes like baking (depending on material, such as mid-temp trays up to 140°C) or cleaning processes.
4. Component Compatibility: Besides traditional ICs (like QFP, BGA, TSOP, PGA etc.), JEDEC trays are also used for non-traditional electronic components including connectors, PCBs, MEMS, lenses, watch parts, and even synthetic stones, leveraging the standardized automation equipment.
Customization:
A key design genius of the JEDEC standard is that while the external size and features are rigorously defined, the interior component pockets were intentionally left undefined and unrestricted. This freedom is the engine for the tray’s immense adaptability. And Hiner-pack offer customized materials to meet specific ESD protection, temperature compatibility, chemical compatibility, or mechanical strength requirements.
