Product Description:
In the demanding realm of microelectronics, JEDEC matrix trays serve as the established protocol for component management, ensuring the integrity and efficient handling of high-value ICs and modules. Their designation as "waffle" or "matrix" trays reflects the organized, pocketed structure that secures components in a fixed array of rows and columns. This fixed position and defined spacing are crucial, as they allow absolute dimensional location for automated equipment. The trays adhere to a single, non-negotiable external outline of 12.7 x 5.35 inches (322.6 x 136mm), a dimensional constant that underpins the entire ecosystem of JEDEC-compatible automation. The robust construction, typically from ESD-safe polymers, is a prerequisite, with specifications demanding minimum twist and maximum strength to withstand the rigors of automated handling and global logistics. The material must be clearly marked with its maximum operating temperature—the highest temperature it can endure for 48 continuous hours without compromising its critical dimensional tolerance. This commitment to dimensional stability under thermal stress makes JEDEC trays reliable carriers for both shipping and high-temperature processing, such as component baking.
Features & Benefits:
The inherent value proposition of JEDEC trays lies in their "Precision Built In" design, which significantly minimizes manufacturing risk and enhances process throughput. The trays are engineered with well-established reference features and datums that streamline equipment integration. A cornerstone of their design is the Automation Ready suite of features. The asymmetric end tabs are a clever feature that mechanically prevents improper orientation in feeding mechanisms, acting as an additional safeguard beyond the Pin 1 visual indicators. The sculpted scalloped feature provides a mechanical keying mechanism for positive registration within feeders. Furthermore, designated space for marking and engraving is provided, making the trays a practical tool for inventory management and process tracking. The standard low-profile thickness of 0.25 inches (6.35mm) is expertly designed to accommodate 90% of all standard, lower-profile components like CSP and TQFP, optimizing tray density. The optional 0.40-inch high-profile version ensures that thicker components, such as multi-layer modules or Pin Grid Arrays (PGA), can be stored and transported with the same level of standardized security and precision.
Technical Parameters:
| Brand |
Hiner-pack |
| Model |
HN24148 |
| Material |
MPPO |
| Package Type |
IC Component |
| Color |
Black |
| Resistance |
1.0x10e4-1.0x10e11Ω |
| Outline Line Size |
322.6x135.9x10.0mm |
| Cavity Size |
20.0*14.7*3.0mm |
| Matrix QTY |
6*12=72PCS |
| Flatness |
MAX 0.76mm |
| Service |
Accept OEM, ODM |
| Certificate |
RoHS, IOS |
Applications:
1. Component Protection (ESD and Mechanical)
2. High-Temperature Processes (Baking)
3. Feeder System Compatibility
4. Inter-Industry Standardization
Customization:
The ability to customize the internal matrix while adhering to the standard external footprint is the Adaptable and Process Compatible strength of JEDEC trays.
Component-Specific Geometry Protection: The interior cell geometry is highly adaptable to the unique needs of different component types.
Universal vs. Dedicated Trays: Some component types, like PGA packages, can utilize unique "universal" trays capable of holding a variety of sizes, owing to the strength of their pin arrays. However, for most other packages, a dedicated, custom-molded tray is designed to maximize protection and capacity for that specific device.
